During the life cycle of a product, various environmental conditions will be encountered, and the weak point of product appear damage or fail, even declines the reliability of the product. These two tests are not only simulating the real environment, but also one of the purpose is to apply stress on the DUT(Device Under Test); via aging the DUT the weak or damage point could be determined and even to check if the quality of design and manufacture.

Temperature Cycling Test
With temperature change rate of 5℃~15℃ per minute, continuously execute high temperature and low temperature cycle tests. 
 
<Temp. cycling test profile>
Temperature Cycling Test Application:
  • Module/System products environmental simulation
  • Module/System products accelerated life test(Strife test)
  • PCB/PCBA/Solder Joint accelerated stress test(ALT/AST)
  • Component package quality verification



Temperature Shock Test
With temperature change rate of exceed 40℃ per minute, continuously execute high temperature and low temperature shock tests. There are 2 kinds of equipment to execute temperature shock test, includes air to air chamber and liquid to liquid chamber, and the transfer time of both equipment must be during 10 to 20 seconds.
 
<Temp. shock test profile>
Temperature Shock Test Application:
  • PCB reliability accelerated test
  • Automotive component accelerated life test
  • LED component accelerated test
  • Combination quality between different materials connection
 

 

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